宇航计测技术 ›› 2023, Vol. 43 ›› Issue (6): 71-75.doi: 10.12060/j.issn.1000-7202.2023.06.13

• 精密测试技术 • 上一篇    下一篇

基于工业CT的零件低温微形变测量方法研究

杜德渝,贾培智,黎雄威,刘林,赵宾,王晓宁,宋金城   

  1. 北京航天计量测试技术研究所,北京 100076
  • 出版日期:2023-12-08 发布日期:2023-12-11
  • 作者简介:杜德渝(1996-),男,工程师,硕士,主要研究方向:计量技术与仪器。

Research on Measurement Method of Low Temperature Microdeformation of Parts Based on Industrial CT#br#

DU De-yu,JIA Pei-zhi,LI Xiong-wei,Liu Lin,ZHAO Bin,WANG Xiao-ning,SONG Jin-cheng   

  1. Beijing Aerospace Institute for Metrology and Measurement,Beijing 100076,China
  • Online:2023-12-08 Published:2023-12-11

摘要: 为解决低温条件下零件微形变直接测量难题,提出了基于高精度工业CT(Industrial Computerized Tomography,ICT)的零件低温微形变测量方法。基于工业CT搭建低温微形变测试平台,依照构建的电压电流参数组合表对样品在低温和常温环境下分别扫描测量。首先介绍了工业CT的成像原理,然后阐述了低温条件下零件微形变测量过程中的关键技术,最后详细描述了试验结果并进行了分析。结果表明,所提出的测量方法重复性好,解决了零件低温微形变无法直接测量的难题。对于材质线膨胀系数未精确测算的样品,可以使用工业CT测量样品微形变以替代使用借鉴的线膨胀系数估算微形变的方法。

关键词: 低温, 工业CT, 形变测量

Abstract: In order to solve the problem of directly measuring microdeformation of parts under low temperature conditions,a measurement method for low-temperature microdeformation of parts based on high-precision Industrial Computerized Tomography (ICT) was proposed.A testing platform for low-temperature microdeformation was established based on ICT,and the parts were scanned and analyzed under both low-temperature and normal-temperature conditions following a constructed table of voltage-current parameter combinations.The imaging principle of ICT was introduced initially,followed by an elucidation of key technologies involved in measuring microdeformation of parts under low-temperature conditions,and finally the experimental results were detailedly described and analyzed.The findings indicated that the proposed measurement method exhibited good repeatability and the problem of direct measurement of microdeformation in parts at low temperatures was effectively solved.For parts of which material linear expansion coefficients have not been precisely measured,ICT can be used to measure microdeformation,serving as an alternative to estimating microdeformation using referenced linear expansion coefficients.

Key words: Low temperature, ICT, Deformation measurement

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