Journal of Astronautic Metrology and Measurement ›› 2023, Vol. 43 ›› Issue (6): 71-75.doi: 10.12060/j.issn.1000-7202.2023.06.13

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Research on Measurement Method of Low Temperature Microdeformation of Parts Based on Industrial CT#br#

DU De-yu,JIA Pei-zhi,LI Xiong-wei,Liu Lin,ZHAO Bin,WANG Xiao-ning,SONG Jin-cheng   

  1. Beijing Aerospace Institute for Metrology and Measurement,Beijing 100076,China
  • Online:2023-12-25 Published:2023-12-25

Abstract: In order to solve the problem of directly measuring microdeformation of parts under low temperature conditions,a measurement method for low-temperature microdeformation of parts based on high-precision Industrial Computerized Tomography (ICT) was proposed.A testing platform for low-temperature microdeformation was established based on ICT,and the parts were scanned and analyzed under both low-temperature and normal-temperature conditions following a constructed table of voltage-current parameter combinations.The imaging principle of ICT was introduced initially,followed by an elucidation of key technologies involved in measuring microdeformation of parts under low-temperature conditions,and finally the experimental results were detailedly described and analyzed.The findings indicated that the proposed measurement method exhibited good repeatability and the problem of direct measurement of microdeformation in parts at low temperatures was effectively solved.For parts of which material linear expansion coefficients have not been precisely measured,ICT can be used to measure microdeformation,serving as an alternative to estimating microdeformation using referenced linear expansion coefficients.

Key words: Low temperature, ICT, Deformation measurement

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