宇航计测技术 ›› 2021, Vol. 41 ›› Issue (1): 38-42.doi: 10.12060/j.issn.1000-7202.2021.01.07

• 量值传递技术 • 上一篇    下一篇

器件串联电阻对脉冲电流结温测试方法影响研究

郑世棋；李灏；翟玉卫；刘岩；韩伟；吴爱华   

  1. 中国电子科技集团公司第十三研究所，河北石家庄 050051
  • 出版日期:2021-02-25 发布日期:2022-03-07
  • 作者简介:郑世棋（1963.05-），男，高级工程师，本科，主要研究方向：电磁学及热学计量技术。

Research on Influence of Pulsed Current Junction Temperature Measurement Method by Device Series Resistance

ZHENG Shi-qi；LI Hao；ZHAI Yu-wei；LIU Xia-mei；HAN Wei；WU Ai-hua   

  1. The 13th Research Institute China of Electronics Technology Group Corporation,Shijiazhuang 050051,China
  • Online:2021-02-25 Published:2022-03-07

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摘要： 半导体器件电学法结温测试过程中，校温过程同测温过程的热分布状态存在差异，导致串联电阻阻值不一致，是影响脉冲电流方法结温测试准确性的重要原因。以功率二极管为研究对象，通过搭建脉冲电流结温测量装置，对器件整体及主要串联电阻温升进行了电学测试，并利用红外测试手段进行了验证。结果显示，键合线同芯片存在显著温度差异，其串联电阻的改变会导致整体测温结果发生较大偏差。

关键词: 电学法, 结温测量, 脉冲电流法, 串联电阻, 热分布

Abstract: During the measurement of junction temperature by electrical method,states of thermal distribution in temperature calibration and temperature measurement are different,which lead to the inconformity of the value of series resistance,is an important factor which affects the accuracy of the pulsed current junction temperature measurement method.With power diode as research object,pulsed current junction temperature measurement system was built,and electrical measurement on the whole device temperature and series resistor temperature was conducted,which were compared with infrared testing data.Result indicates that temperatures of the bonding wires and chip are quite different,and the change of the bonding wires resistance will cause remarkable deviation in the junction temperature result.

Key words: Electrical method, Junction temperature measurement, Pulsed current method, Series resistor, Thermal distribution

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