关键词: 金属键合引线, X-CT, 测量夹具, S参数

Abstract: The accurate measurement of the three-dimensional appearance of metal bonding wire and the simulation of the S parameters of bonded wire are important means to evaluate the influence of bonding wire on device cascade process. X ray computed tomography is an effective tool for measuring metal bonding wire in cascaded circuit chip. Due to the particularity of material, shape and size of bonding wire in cascade circuit chip, we need to design a special fixture to improve the measurement accuracy. In this article, a new type of measuring fixture with more stable and higher accuracy is designed by structural optimization and material screening.

Key words: Metal bonding wire, X-CT, Measuring fixture, S parameters.